| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 1995 | A generalized quasi-chemical model for ordered multi-component, multi-sublattice intermetallic compounds with anti-structure defects | Chen S.-L.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Intermetallics | 23 | 26 | |
| 2013 | Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections | Chen Y.J.; Yang T.L.; Yu J.J.; Kao C.L.; C. ROBERT KAO ; C. ROBERT KAO | Materials Letters | 15 | 14 | |
| 2021 | Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications | Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 1 | 1 | |
| 2017 | Grain Boundary Penetration of Various Types of Ni Layer by Molten Metals | Yang S.; Chang C.Y.; Zhu Z.X.; Lin Y.F.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 0 | 0 | |
| 2010 | Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn-Zn systems | Tsai, M.Y.; Yang, S.C.; Wang, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | 24 | 25 |  |
| 2013 | Grain refinement of solder materials by minor element addition | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO ; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 5 | 0 | |
| 2014 | Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer | Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; C. ROBERT KAO ; C. ROBERT KAO | Solar Energy Materials and Solar Cells | 31 | 31 | |
| 2011 | Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding | Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 51 | 0 | |
| 2018 | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO | Electronic Components and Technology Conference | 9 | 0 | |
| 2022 | High-Temperature Reliability of Sintered Silver-Tin Alloy Paste for Die Attach Applications | Huang, Wei Chen; Tsai, Chin Hao; C. ROBERT KAO | 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings | 0 | 0 | |
| 2022 | Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps | Kao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; Huang, Wei Chen; Chang, Fu Ling; C. ROBERT KAO | Materials | 2 | 2 | |
| 2021 | Highly uniform microfluidic electroless interconnections for chip stacking applications | Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO | Electrochimica Acta | 17 | 15 | |
| 2019 | Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration | Shigetou, A.; Yang, T.H.; Kao, C.R.; C. ROBERT KAO | IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 | 0 | 0 | |
| 2022 | Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquat | Maheshwaran S; Renganathan V; Chen S.-M; Balaji R; C. ROBERT KAO ; Chandrasekar N; Ethiraj S; Samuel M.S; Govarthanan M. | Chemosphere | 16 | 12 | |
| 2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | 147 | 139 | |
| 2015 | In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints | Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | 2 | 0 | |
| 2006 | In-situ observation of material migration in flip-chip solder joints under current stressing | Tsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 9 | |
| 2002 | Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints | Ho C.E.; Shiau L.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 65 | 60 | |
| 2010 | Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders | Wang, Y.W.; Lin, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | 44 | 36 | |
| 2014 | Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuits | Shih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 8 | |
