| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2018 | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO | Electronic Components and Technology Conference | 9 | 0 | |
| 2022 | High-Temperature Reliability of Sintered Silver-Tin Alloy Paste for Die Attach Applications | Huang, Wei Chen; Tsai, Chin Hao; C. ROBERT KAO | 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings | 0 | 0 | |
| 2022 | Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps | Kao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; Huang, Wei Chen; Chang, Fu Ling; C. ROBERT KAO | Materials | 2 | 2 | |
| 2021 | Highly uniform microfluidic electroless interconnections for chip stacking applications | Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO | Electrochimica Acta | 17 | 15 | |
| 2019 | Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration | Shigetou, A.; Yang, T.H.; Kao, C.R.; C. ROBERT KAO | IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 | 0 | 0 | |
| 2022 | Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquat | Maheshwaran S; Renganathan V; Chen S.-M; Balaji R; C. ROBERT KAO ; Chandrasekar N; Ethiraj S; Samuel M.S; Govarthanan M. | Chemosphere | 16 | 12 | |
| 2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | 147 | 139 | |
| 2015 | In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints | Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | 2 | 0 | |
| 2006 | In-situ observation of material migration in flip-chip solder joints under current stressing | Tsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 9 | |
| 2002 | Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints | Ho C.E.; Shiau L.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 65 | 60 | |
| 2010 | Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders | Wang, Y.W.; Lin, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | 44 | 36 |  |
| 2014 | Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuits | Shih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 8 | |
| 2010 | Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer | CHIEN-CHENG CHANG ; Chung, H.Y.; Lai, Y.S.; C. ROBERT KAO | Journal of electronic materials | 9 | 7 | |
| 2001 | Interactions between solder and metallization during long-term aging of advanced microelectronic packages | Ho C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 57 | 57 | |
| 2020 | Interconnections of low-temperature solder and metallizations | Wang Y; Kao C.R.; C. ROBERT KAO | Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020 | 1 | 0 | |
| 2015 | Interfacial Energy Effect on the Distribution of Ag3Sn in Full Intermetallic Joints | Yang T.-L.; Zhu Z.-X.; Yu J.-J.; Lin Y.-F.; Kao C.R.; C. ROBERT KAO | Advanced Engineering Materials | 3 | 3 | |
| 2009 | Interfacial reaction and the dominant diffusing species in Mg-Ni system | Tsai M.Y.; Chou M.H.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 20 | 18 | |
| 2009 | Interfacial reaction and wetting behavior between Pt and molten solder | Yang S.C.; Chang W.C.; Wang Y.W.; C. ROBERT KAO | Journal of Electronic Materials | 14 | 17 | |
| 2010 | Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints | CHIEN-CHENG CHANG ; Wang, Y.W.; Lai, Y.S.; C. ROBERT KAO | Journal of electronic materials | 8 | 7 | |
| 2023 | Interfacial Reaction between Silver and Solid Indium | Fang, I. C.; Chang, F. L.; Chang, C. C.; C. ROBERT KAO | 2023 International Conference on Electronics Packaging, ICEP 2023 | | | |
