| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2009 | Journal of Electronic Materials: Foreword | Kang S.K.; Anderson I.; Chada S.; Duh J.-G.; Turbini L.J.; Wu A.; C. ROBERT KAO ; Hua F.; Subramanian K.N.; Frear D.; Handwerker C.; Guo F.; Chawla N.; Zeng, Kejun | Journal of Electronic Materials | 2 | 0 | |
| 2006 | Journal of Electronic Materials: Foreword | Chawla N.; Chada S.; Kang S.K.; C. ROBERT KAO ; Lin K.-L.; Lucas J.; Turbini L. | Journal of Electronic Materials | 2 | 0 | |
| 2006 | Journal of Electronic Materials: Foreword | Suganuma K.; Chen S.-W.; Kao C.R.; Lee H.M.; Swenson D.J.; C. ROBERT KAO | Journal of Electronic Materials | 0 | 0 | |
| 2022 | Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulation | Grafner, S. J.; Huang, J. H.; Chen, Y. A.; Shih, P. S.; Huang, C. H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 3 | 0 | |
| 2006 | Kinetics of AuSn 4 migration in lead-free solders | Chang C.W.; Ho C.E.; Yang S.C.; C. ROBERT KAO | Journal of Electronic Materials | 23 | 20 | |
| 2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | 93 | 82 | |
| 2011 | Laminar pattern induced by cycling thermomechanical stress in two-phase materials | Chang, C.C.; Chen, Y.J.; Tsai, M.Y.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Materials Chemistry and Physics | 0 | 0 |  |
| 2023 | Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging | Tsai, Chin Hao; Steiner, Felix; Ishikawa, Dai; C. ROBERT KAO ; Blank, Thomas | 2023 International Conference on Electronics Packaging, ICEP 2023 | | | |
| 2008 | Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology | Kao, C. Robert | JOM | | |  |
| 2008 | Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology | Kao, C.R.; C. ROBERT KAO | JOM | 0 | 0 | |
| 2002 | Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish | Luo W.-C.; Kao C.R.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | 14 | 0 | |
| 2006 | Local melting induced by electromigration in flip-chip solder joints | Tsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; C. ROBERT KAO ; C. ROBERT KAO | Journal of Electronic Materials | 61 | 57 | |
| 2023 | Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate | Hung, Han Tang; Chang, Fu Ling; Tsai, Chin Hao; Liao, Chia Yi; C. ROBERT KAO | Materials | | | |
| 2000 | Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate | Chen C.; Ho C.E.; Lin A.H.; Luo G.L.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 55 | 52 | |
| 2019 | Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections | Hung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 4 | 0 | |
| 2015 | Low temperature bonding for high temperature applications by using SnBi solders | Yang T.L.; Wu J.Y.; Li C.C.; Yang S.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 44 | 42 | |
| 2021 | Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment | Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO | Journal of Materials Research and Technology | 9 | 6 | |
| 2023 | Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic System | Shih, Po Shao; Huang, Jeng Hau; Shen, Chang Hsien; Lin, Yu Chun; Grufner, Simon Johannes; Renganathan, Vengudusamy; Kao, Chin Li; LIN, Y. S.; Hung, Yun Ching; Chiang, Chun Wei; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 0 | 0 | |
| 2016 | Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | 9 | 0 | |
| 2007 | Massive spalling of intermetallic compound in lead-free solder joints | Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO | Materials Research Society Symposium | 1 | | |
