| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2007 | Massive spalling of intermetallic compound in lead-free solder joints | Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO | Materials Research Society Symposium | 1 | | |
| 2007 | Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element | Yang S.C.; Ho C.E.; Chang C.W.; Kao C.R.; C. ROBERT KAO | Journal of Applied Physics | 46 | 44 | |
| 2007 | Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems | Yang S.C.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 2 | 0 | |
| 2002 | Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages | Lin Y.L.; Tsai J.; Kao C.R.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | 3 | 0 | |
| 2018 | Materials merging mechanism of microfluidic electroless interconnection process | Yang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; Kao C.R.; C. ROBERT KAO | Journal of the Electrochemical Society | 17 | 14 | |
| 2019 | Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compression | Wu J.Y.; Chiu Y.S.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Materials Science and Engineering A | 9 | 9 | |
| 2019 | Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications | Wu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO | Electronic Components and Technology Conference | 2 | 0 | |
| 1996 | A mechanism for reactive diffusion between Si single crystal and NbC powder compact | Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO | Journal of Materials Research | 9 | 8 | |
| 2012 | Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing | Ke, J.H.; Chuang, H.Y.; Shih, W.L.; C. ROBERT KAO | Acta Materialia | 67 | 65 |  |
| 2015 | Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn | Li C.C.; Ke J.H.; Yang C.A.; Kao C.R.; C. ROBERT KAO | Materials Letters | 17 | 19 | |
| 2017 | Micromechanical behavior of single crystalline Ni 3 Sn 4 in micro joints for chip-stacking applications | Yu L.J.; Yen H.W.; Wu J.Y.; Yu J.J.; C. ROBERT KAO ; HUNG-WEI YEN | Materials Science and Engineering A | 10 | 10 | |
| 2017 | Micromechanical behavior of single-crystalline Cu 6 Sn 5 by picoindentation | Yu J.J.; Wu J.Y.; Yu L.J.; Yang H.W.; Kao C.R.; C. ROBERT KAO | Journal of Materials Science | 9 | 7 | |
| 2019 | Micropillar mechanics of Sn-based intermetallic compounds | Yu, J.J.; Wu, J.Y.; Yu, L.J.; Kao, C.R.; C. ROBERT KAO | Handbook of Mechanics of Materials | 2 | 0 | |
| 2018 | Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion | Chiu Y.S.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 2 | 0 | |
| 2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
| 2008 | Microstructure study of high lead bump FCBGA bending test | Hung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; Kao C.R.; C. ROBERT KAO | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | 2 | 0 | |
| 1997 | Microstructures developed in solid-liquid reactions: Using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples | Kao C.R.; C. ROBERT KAO | Materials Science and Engineering A | 72 | 69 | |
| 2009 | Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth | Wang Y.W.; Chang C.C.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Journal of Alloys and Compounds | 98 | 90 | |
| 2008 | Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth | Wang Y.W.; Kao C.R.; C. ROBERT KAO | 2008 10th International Conference on Electronic Materials and Packaging | 4 | 0 | |
| 1990 | Model for micelle formation in copolymer/homopolymer blends | Kao C.R.; De La Cruz M.O.; C. ROBERT KAO | The Journal of Chemical Physics | 15 | 15 | |
