| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2002 | New failure mode induced by electric current in flip chip solder joint | Lin Y.H.; Hu Y.C.; Tsai J.; Kao C.R.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | 1 | 0 | |
| 2021 | A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn | Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO | Intermetallics | 4 | 4 | |
| 2023 | A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging | Huang, Jeng Hau; Shih, Po Shao; Shen, Chang Hsien; Renganathan, Vengudusamy; Grafner, Simon Johannes; Lin, Yu Chun; Kao, Chin Li; LIN, Y. S.; Hung, Yun Ching; Chiang, Chun Wei; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 0 | 0 | |
| 2010 | Novel Cu-RuNx composite layer with good solderability and very low consumption rate | Chuang, H.Y.; Lin, C.H.; Chu, J.P.; C. ROBERT KAO | Journal of Alloys and Compounds | 11 | 11 |  |
| 2022 | A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging | Shih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
| 2016 | Novel Self-shrinking Mask for Sub-3 nm Pattern Fabrication | Yang P.-S.; Cheng P.-H.; Kao C.R.; C. ROBERT KAO ; MIIN-JANG CHEN | Scientific Reports | 9 | 12 | |
| 2021 | Numerical analysis of an electroless plating problem in gas–liquid two-phase flow | Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO | Fluids | 2 | 1 | |
| 1993 | On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds | Kao C.R.; Chang Y.A.; C. ROBERT KAO | Intermetallics | 127 | 109 | |
| 1993 | On the optimization of solution model parameter values of phases and the calculation of phase diagrams | Chen S.-L.; Zuo Y.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Calphad | 8 | 9 | |
| 1996 | On the relationships between the self-diffusion parameters and the thermodynamic properties in B2 intermetallic compounds | Kao C.R.; C. ROBERT KAO | Chinese Journal of Physics | 0 | | |
| 1996 | On the site preferences of ternary additions to triple defect B2 intermetallic compounds | Pike L.M.; Kao C.R.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO | TMS Annual Meeting | 1 | | |
| 2015 | Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications | Yu J.J.; Yang C.A.; Lin Y.F.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | 32 | 31 | |
| 2000 | Optimizing the wire-bonding parameters for second bonds in ball grid array packages | Ho C.E.; Chen C.; Kao C.R.; C. ROBERT KAO | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an | 0 | 0 | |
| 2019 | Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Scientific Reports | 8 | 6 | |
| 2018 | Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | 3 | 0 | |
| 2011 | The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction | Chen W.M.; Yang T.L.; Chung C.K.; C. ROBERT KAO ; C. ROBERT KAO | Scripta Materialia | 31 | 31 | |
| 2012 | Origin and evolution of voids in electroless Ni during soldering reaction | Chung C.K.; Chen Y.J.; Chen W.M.; C. ROBERT KAO | Acta Materialia | 32 | 31 | |
| 2010 | Oxidation behavior of ENIG and ENEPIG surface finish | Lee C.C.; Chuang H.Y.; Chung C.K.; Kao C.R.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | 9 | 0 | |
| 2016 | Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study | Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO | Acta Materialia | 21 | 16 | |
| 2022 | Periodic copper microbead array on silver layer for dual mode detection of glyphosate | Balaji, Ramachandran; Renganathan, Vengudusamy; Chu, Chia Pei; YING-CHIH LIAO ; C. ROBERT KAO ; Chen, Shen Ming | OpenNano | 2 | 0 | |
