| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2016 | Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study | Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO | Acta Materialia | 21 | 16 | |
| 2022 | Periodic copper microbead array on silver layer for dual mode detection of glyphosate | Balaji, Ramachandran; Renganathan, Vengudusamy; Chu, Chia Pei; YING-CHIH LIAO ; C. ROBERT KAO ; Chen, Shen Ming | OpenNano | 2 | 0 | |
| 2002 | Phase diagrams of important electronic materials | C. ROBERT KAO ; C. ROBERT KAO | JOM | 5 | 5 | |
| 1993 | Phase equilibria of the cu-in system I: Experimental investigation | Bolcavage A.; Chen S.W.; Kao C.R.; Chang Y.A.; Romig A.D.; C. ROBERT KAO | Journal of Phase Equilibria | 61 | 0 | |
| 1993 | Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagram | Kao C.R.; Bolccwage A.; Chen S.-L.; Chen S.W.; Chang Y.A.; Romig A.D.; C. ROBERT KAO | Journal of Phase Equilibria | 30 | 0 | |
| 1998 | Phase equilibria of the Si-Ge-Ti system relevant to the reactions between SiGe alloys and Ti | Jain T.A.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 4 | 4 | |
| 2014 | Phase field microelasticity model of dislocation climb: Methodology and applications | Ke J.H.; Boyne A.; Wang Y.; Kao C.R.; C. ROBERT KAO | Acta Materialia | 26 | 20 | |
| 2019 | Phase formation and microstructure evolution in Cu/In/Cu joints | Chiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | 15 | 14 | |
| 1999 | Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system | Jain T.A.; Huang C.G.; Ho C.E.; Kao C.R.; C. ROBERT KAO | Materials Transactions | 7 | 4 | |
| 2020 | Phase stabilities and interfacial reactions of the Cu�VIn binary systems | Lin, Y.F.; Hung, H.T.; Yu, H.Y.; Kao, C.R.; Wang, Y.W.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | 10 | 8 | |
| 2013 | Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing | Huang, T.C.; Yang, T.L.; Ke, J.H.; Li, C.C.; C. ROBERT KAO ; C. ROBERT KAO | Journal of Alloys and Compounds | 18 | 18 | |
| 2020 | Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structure | Sheikhi, R.; Huo, Y.; Tsai, C.-H.; Kao, C.R.; Shi, F.G.; Lee, C.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | 7 | 5 | |
| 2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 14 | 13 | |
| 2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang J.R.; Tsai C.M.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Materials Research | 54 | 49 | |
| 1999 | Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering | Ho C.E.; Chen Y.M.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 88 | 79 | |
| 2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho C.E.; Tsai S.Y.; Kao C.R.; C. ROBERT KAO | IEEE Transactions on Advanced Packaging | 58 | 45 | |
| 2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 8 | 6 | |
| 2002 | Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Shiau L.C.; Ho C.E.; C. ROBERT KAO ; C. ROBERT KAO | Soldering and Surface Mount Technology | 110 | 101 | |
| 2013 | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | Chung C.K.; Chen Y.J.; Yang T.L.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 7 | |
| 1997 | Reactions of solid copper with pure liquid tin and liquid tin saturated with copper | Hayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Scripta Materialia | 64 | 60 | |
