| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 1999 | Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering | Ho C.E.; Chen Y.M.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 88 | 79 | |
| 2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho C.E.; Tsai S.Y.; Kao C.R.; C. ROBERT KAO | IEEE Transactions on Advanced Packaging | 58 | 45 | |
| 2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 8 | 6 | |
| 2002 | Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Shiau L.C.; Ho C.E.; C. ROBERT KAO ; C. ROBERT KAO | Soldering and Surface Mount Technology | 110 | 101 | |
| 2013 | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | Chung C.K.; Chen Y.J.; Yang T.L.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 7 | |
| 1997 | Reactions of solid copper with pure liquid tin and liquid tin saturated with copper | Hayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Scripta Materialia | 64 | 60 | |
| 1996 | Reactive diffusion between silicon and niobium carbide: Application to the in-situ synthesis of a silicon carbide-niobium disilicide composite | Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO | TMS Annual Meeting | 1 | | |
| 2020 | The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology | Lu, P.-Y.; Li, Y.-R.; Yen, C.-M.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 4 | 0 | |
| 2003 | Recent progress in phase diagram calculation and application | C. ROBERT KAO | JOM | 1 | 1 | |
| 2015 | Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping | Bashir M.N.; Haseeb A.S.M.A.; Rahman A.Z.M.S.; Fazal M.A.; Kao C.R.; C. ROBERT KAO | Journal of Materials Science | 48 | 45 | |
| 2019 | Refine microstructure of solder materials via minor element additions | Chung C.K.; Yu J.J.; Yang T.L.; Kao C.R.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | 0 | | |
| 2001 | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Liu C.M.; Ho C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 65 | 58 | |
| 2013 | Reliability of micro-interconnects in 3D IC packages | Robert Kao, C.; Wu, Albert T.; Tu, King-Ning; Lai, Yi-Shao; C. ROBERT KAO | Microelectronics Reliability | 8 | 7 | |
| 2007 | Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu | Yang S.C.; Kao C.R.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | 2 | 0 | |
| 2012 | Roles of phosphorous in Sn 4Ag 0.5Cu solder reaction with electrolytic Ni-Au | Key Chung C.; Huang T.C.; Shia R.; Yang T.L.; C. ROBERT KAO ; C. ROBERT KAO | Journal of Alloys and Compounds | 7 | 9 | |
| 1999 | Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallization | Chen, C. P.; Lin, C. F.; Swenson, D.; Kao, C. R.; Jan, C. H.; Chang, Y. A.; C. ROBERT KAO | Journal of Vacuum Science & Technology B | 0 | 2 | |
| 2001 | Selective interfacial reaction between Ni and eutectic BiSn lead-free solder | Tao W.H.; Chen C.; Ho C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO | Chemistry of Materials | 61 | 57 | |
| 2019 | Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits | Weng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO | Scripta Materialia | 12 | 11 | |
| 2003 | SEM/EDS的原理與操作應用之簡介半導體工業構裝材料 | 何政恩; 高振宏 | 化工技術 | | | |
| 2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO ; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 | |
