| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 1999 | Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallization | Chen, C. P.; Lin, C. F.; Swenson, D.; Kao, C. R.; Jan, C. H.; Chang, Y. A.; C. ROBERT KAO | Journal of Vacuum Science & Technology B | 0 | 2 | |
| 2001 | Selective interfacial reaction between Ni and eutectic BiSn lead-free solder | Tao W.H.; Chen C.; Ho C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO | Chemistry of Materials | 61 | 57 | |
| 2019 | Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits | Weng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO | Scripta Materialia | 12 | 11 | |
| 2003 | SEM/EDS的原理與操作應用之簡介半導體工業構裝材料 | 何政恩; 高振宏 | 化工技術 | | | |
| 2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO ; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 | |
| 2015 | Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing | Li C.C.; Drymiotis F.; Liao L.L.; Dai M.J.; Liu C.K.; Chen C.L.; Chen Y.Y.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Energy Conversion and Management | 24 | 23 | |
| 2019 | A single bonding process for diverse organic-inorganic integration in IoT devices | Yang T.H.; Chiu Y.-S.; Yu H.-Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 0 | 0 | |
| 2019 | A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process | Yang T.H.; Yang C.Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO | 2019 International Conference on Electronics Packaging | 3 | 0 | |
| 2013 | Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics | Chen Y.J.; Chung C.K.; Yang C.R.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | 54 | 47 | |
| 2020 | Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs | Tsai, C.-H.; Huang, W.-C.; Kao, C.R.; Chew, L.M.; Schmitt, W.; Nishikawa, H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 3 | 0 | |
| 1994 | Site preference of substitutional additions to triple-defect B2 intermetallic compounds | Kao C.R.; Pike L.M.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO | Intermetallics | 47 | 47 | |
| 2010 | Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactions | Tsai, M.H.; Chen, W.M.; Tsai, M.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | 14 | 12 |  |
| 2006 | SnAgCu系列無鉛銲料應用於先進微電子封裝之研究 | 高振宏 ; 楊素純 | 工程科技通訊 | | | |
| 2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO ; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 | |
| 2022 | Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation | Tatsumi, Hiroaki; C. ROBERT KAO ; Nishikawa, Hiroshi | Scientific Reports | 1 | 0 | |
| 2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Materials Science and Engineering A | 115 | 102 | |
| 2003 | Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword | Lucas, J. P.; Chada, S.; Kang, S. K.; Kao, C. R.; Lin, K. L.; Ready, J.; Yu, J.; C. ROBERT KAO | Journal of Electronic Materials | 4 | 1 | |
| 2004 | Special issue on Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III - Foreword | Kao, C. R.; Chen, S. W.; Lee, H. M.; Mohney, S. E.; Notis, M. R.; Swenson, D. J.; C. ROBERT KAO | Journal of Electronic Materials | 0 | 0 | |
| 2006 | Special issue papers: Phase stability, phase transformations, and reactive phase formation in electronics materials IV - Foreword | Chen, S. W.; Kao, C. R.; Lee, H. M.; Mohney, S.; Suganuma, K.; Swenson, D. J.; Chada, S.; C. ROBERT KAO | Journal of Electronic Materials | 4 | 1 | |
| 2010 | Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrate | Chen W.M.; Kao C.R.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | 0 | 0 | |
