| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2010 | Temperature effects on electromigration behavior of solder joints | Ke J.-H.; Kao C.R.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | 2 | 0 | |
| 2022 | Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion Layers | Kao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; C. ROBERT KAO | 2022 International Conference on Electronics Packaging, ICEP 2022 | 0 | 0 | |
| 1993 | A theoretical analysis for the formation of periodic layered structure in ternary diffusion couples involving a displacement type of reactions | Kao C.R.; Chang Y.A.; C. ROBERT KAO | Acta Metallurgica Et Materialia | 53 | 51 | |
| 2022 | Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface | Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
| 2014 | Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow | Key Chung C.; Zhu Z.X.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 3 | 3 | |
| 2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 29 | 29 | |
| 2007 | Tin whisker growth induced by high electron current density | Lin Y.W.; Kao C.R.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | 2 | 0 | |
| 2010 | Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints | Tsai, M.Y.; Lin, Y.L.; Lin, Y.W.; Ke, J.H.; C. ROBERT KAO | Journal of electronic materials | 2 | 2 |  |
| 2009 | Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints | Tsai M.-Y.; Lin Y.-L.; Kao C.R.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | 1 | 0 | |
| 2010 | Uncovering the driving force for massive spalling in the Sn-Cu/Ni system | Chen, W.M.; Yang, S.C.; Tsai, M.H.; C. ROBERT KAO | Scripta Materialia | 27 | 25 | |
| 2000 | Using tert-butyl alcohol as an adductive agent for separation of an m-cresol and 2,6-xylenol mixture | Lee, L. S.; Lin, C. W.; Kao, C. H.; C. ROBERT KAO | Industrial & Engineering Chemistry Research | 18 | 17 | |
| 2020 | Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish | Weng, I.A.; Hung, H.T.; Huang, W.C.; Kao, C.R.; Chen, Y.H.; C. ROBERT KAO | Journal of Electronic Materials | 6 | 5 | |
| 2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | 32 | 0 | |
| 2014 | Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints | Li C.C.; Chung C.K.; Shih W.L.; C. ROBERT KAO | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 28 | 26 | |
| 2013 | Volume shrinkage induced by interfacial reactions in micro joints | Li C.C.; Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO | International Symposium on Advanced Packaging Materials | 2 | 0 | |
| 2021 | White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5 | Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO | 2021 International Conference on Electronics Packaging, ICEP 2021 | 1 | 0 | |
| 2002 | 先進封裝技術中金脆效應對銲點影響之探討 | 何政恩; 蕭麗娟; 高振宏 | 電子與材料 | | | |
| 2004 | 先進微電子封裝中錫銀銅銲料與金/鎳 表面處理層之界面反應 | 羅偉誠 ; 蕭麗娟; 何政恩; 高振宏 | Journal of the Chinese Colloid & Interface Science | | | |
| 2006 | 化學工程與材料工程 | 高振宏 | 化工技術 | | | |
| 1997 | 半導體工業構裝材料 | 高振宏 ; 李明勳 | 化工技術 | | | |
