公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1992 | Changes and Properties of Multiple Forms of Pectinesterase in Different Parts of Radish and Pea Plants at Different Stages of Growth | Chang, S. Y.; Liarng, J. H.; 張為憲; Chang, Wei-Hsien | 6th Faob Congress, Shanghai, China(1992.11) | | | |
2002 | Characterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substrates | Chiu, M. Y.; Chang, S. Y.; Tseng, Y. H.; Chan, Y. C.; Chuang, T. H. | Zeitschrift fur Metallkunde 93: | | | |
2002 | Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements | Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S. | Journal of Materials Engineering and Performance | | | |
1965 | Directional Characteristics of Behavioral Change | 劉英茂; Chang, S. Y.; Liu, P.Y.; Tang, M. M.; Liu, In-Mao | Perceptial and Motor Skills | | | |
1988 | Distribution of Seismic Hazards and Risk:Analysis of Buried Pipelines in Taiwan | Loh, Chin-Hsiung ; Chang, S. Y.; ù�T�� ; Chen, S. S. | Journal of the Chinese Institute of Engineers | | | |
2004 | Experimental study of seismic behavior of As-build and CFRP repaired reinforced concrete bridge columns | Chang, S. Y.; Li, Y-F.; Loh, C.-H. | J. of Bridge Engineering 9: | | | |
1992 | An Experimental Study on Alternate Aggradation/Degradation Process | Yen, C. L.; 李鴻源; Chang, S. Y.; Lee, Hong-Yuan | Asce Journal of Hydraulic Engineering | | | |
2008 | Flexible user-centric automation and assistive devices | Liu, J. W. S.; Shih, C. S.; Kuo, T. W.; Chang, S. Y.; Lu, Y. F.; Ouyang, M. K. | Proceedings of Workshop on Adaptable and Reconfigurable Embedded Systems | | | |
2002 | Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films | Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
2004 | Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages | Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. | Journal of Electronic Materials | | | |
2004 | Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004) | Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | 0 | |
2003 | Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages | Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH | Journal of Electronic Materials | | | |
2003 | Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal | Chang, S. Y.; Hung, Y. T.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
2004 | Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates | Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH | Journal of Electronic Materials | | | |
2002 | Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate | Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
2003 | Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy | Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H. | Metallurgical and Materials Transactions A | | | |
2002 | Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions | Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; ChuangTH | Journal of Electronic Materials | 44 | | |
2008 | PtII Complexes with 6-(5-Trifluoromethyl-Pyrazol-3-yl)-2,2′-Bipyridine Terdentate Chelating Ligands: Synthesis, Characterization, and Luminescent Properties | Chen, J. L.; Chang, S. Y.; Chi, Y.; Chen, K.; Cheng, Y. M.; Lin, C. W.; Lee, G. H.; Chou, P. T.; Wu, C. H.; Shih, P. I.; Shu, C. F. | Chemistry-An Asian Journal | | | |
1988 | Recovery of Channel Bed Aggradation/Degradation Process | Yen, Chin-Lien; Lee, Hong-Yuan ; Chang, S. Y. | Proceedings of 23rd Congress, IAHR-APD | | | |
2004 | Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad | Chiang, M. J.; Chang, S. Y.; Chuang, T. H. | Journal of Electronic Materials | | | |