公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2020 | The demonstration of Carbon Nano-Tubes (CNTs) as a promising high Aspect Ratio (>25) through Silicon Vias (TSVs) material for the vertical connection in the high dense 3DICs | Lu P.-Y; Yen C.-M; Chang S.-Y; Feng Y.-J; Lien C; Hu C.-W; Yao C.-W; Lee M.-H; Liao M.-H.; MING-HAN LIAO | Technical Digest - International Electron Devices Meeting, IEDM | |||
2021 | Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy | Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG | Applied Sciences (Switzerland) | |||
2021 | Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina | Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG | Applied Sciences (Switzerland) | |||
2021 | Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper | Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG | Advances in Materials Science and Engineering |