| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
| 2010 | Advanced Materials Research: Preface | Liao, Y.-S.; Chen, C.-C.A.; YUNN-SHIUAN LIAO | Advanced Materials Research | 0 | | |
| 2020 | The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance | Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; WEI-JIUN SU ; C. ROBERT KAO | IEEE Transactions on Electron Devices | 5 | 6 | |
| 2020 | The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology | Lu, P.-Y.; Li, Y.-R.; Yen, C.-M.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 4 | 0 | |
| 2016 | Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposer | Chen, C.-C.A.; Young, H.-T.; Chiou, C.-H.; Xue, M.-Y.; Pan, C.-L.; HONG-TSU YOUNG | China Semiconductor Technology International Conference 2016 | 2 | 0 | |
