公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2020 | Thermal performance analysis of a package using non-simulation technique | Chien, H.-C.; Huang, M.-J.; Chen, Z.-Z.; MEI-JIAU HUANG | 2020 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2020 | | | |
2019 | Thermal spreading resistance of heat sources on rectangular flux channel under non-uniform convective cooling | Huang, M.-J.; Shaw, Y.-R.; Chien, H.-C.; MEI-JIAU HUANG | International Journal of Thermal Sciences | | | |
2012 | Transient behaviors of current-injection quantum-dot microdisk lasers | Mao, M.-H.; Chien, H.-C.; MING-HUA MAO | Optics Express | | | |