公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1990 | Electrical resistivity, magnetization, and grain boundary precipitates in NiSn alloys | Yao, Y. D.; Chen, Y. Y.; Tzeng, S. J.; Chuang, T. H. | Physica Status Solidi | | | |
1991 | Electrical resistivity, magnetization, and grain-boundary precipitate in nickel-rich nickel-indium alloys | Yao, Y. D.; Chen, Y. Y.; Chuang, T. H.; Kung, C.; Lin, C. J. | J. Appl. Phys | | | |
2008 | Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum | Liu, C. Y.; Datta, A.; Liu, N. W.; Wu, Y. R.; Wang, H. H.; Chuang, T. H.; Wang, Y. L. | The Journal of | | | |
1999 | Erosion of SS41 steel by sand blasting | Fang, C. -K.; Chuang, T. H. | Metallurgical and Materials Transactions A | | | |
2000 | Evaluation of Low Temperature Superplastic Formability for Zn-22Ae Thin Sheets | Tsao, L. C.; Yeh, M. S.; Lo, C. J.; Wu, F. C.; Chuang, T. H. | Zeitschrift fur Metallkunde 91: | | | |
1999 | Evaluation of Superplastic Formability for a 5083 Al-Mg alloy | Tseng, Y. H.; Chuang, T. H. | Zeitschrift fur Metallkunde 90: | | | |
2001 | Evaluation of Superplastic Formability of the AZ31, Magnesium Alloy | Tsao, L. C.; Wu, C. F.; Chuang, T. H. | Zeitschrift fur Metallkunde 92: | | | |
2002 | Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing | Tsao, L. C.; Su, T. L.; Chuang, T. H. | Polymer Composites | | | |
1991 | Grain boundary pest of boron- doped Niin3Al at 1200 ?C | Chuang, T. H.; Pan, Y. C.; Hsu, S. E.; ChuangTH | Metallurgical and Materials Transactions A | | | |
1994 | High Temperature Oxidation Behavior of Ni3Al Intermetallic Compounds Containing Zr and Hf | Chang, T. T.; Chuang, T. H. | Chin. J. Mat. Sci. 26: | | | |
1998 | Improving the Creep Resistance of NiAl-Intermetallics through Phase Strengthening-Review and Perspective | Chuang, T. H. | Chin. J. Mat. Sci | | | |
1991 | The Influences of Chromium Addition on the Corrosion Behaviors of Ni3Al-Intermetallic Compounds in Aqreous Solutions | Pan, Y. C.; Chuang, T. H. | Chin. J. Mat. Sci. 23: | | | |
1997 | Interfacial Characteristics for Active Brazing of Alumina to Superalloys | Weng, W. P.; Wu, H. W.; Chai, Y. H.; Chuang, T. H. | Journal of advanced materials | | | |
1997 | Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metals | Weng, W. P.; Chuang, T. H. | Metallurgical and Materials Transactions A | | | |
2002 | Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate | Chiang, M. J.; Chuang, T. H. | Zeitschrift fur Metallkunde | | | |
2000 | Interfacial Reactions between In10Ag Solders and Ag Substrates | Liu, Y. M.; Chuang, T. H. | Journal of Electronic Materials | | | |
2000 | Interfacial Reactions between Liquid In48Sn Solders and Ag Substrates | Huang, Y. T.; Chuang, T. H. | Zeitschrift fur Metallkunde 91: | | | |
2000 | Interfacial reactions between liquid indium and Au-deposited substrates | Liu, Y. M.; Chuang, T. H. | Journal of Electronic Materials | | | |
1999 | Interfacial reactions between liquid indium and nickel substrate | Tseng, Y. H.; Yeh, M. S.; Chuang, T. H. | Journal of Electronic Materials | | | |
2000 | Interfacial Reactions between Liquid Indium and Silver Substrates | Liu, Y. M.; Chen, Y. L.; Chuang, T. H. | Journal of Electronic Materials | | | |