公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2008 | Placement of shorting vias for power integrity in multi-layered structures | S.-H. Hsu; Y.-S. Cheng; W.-D. Guo; H.-H. Cheng; C.-C. Wang; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging |