公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2014 | Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions | Hsu Y.; Wu W.-F. ; Lai S.-L. | 2014 International Conference on Information Science, Electronics and Electrical Engineering | 1 | 0 | |
2013 | Thermal-cyclic fatigue life analysis and reliability estimation of a FCCSP based on probabilistic design concept | Hsu Y.; Su C.-Y.; Wu W.-F. | Computers, Materials and Continua | 2 | ||
2010 | Variability of impact life and reliability assessment of electronic packages | Hsu Y.; Wu W.F ; Su C.Y. | 2010 12th Electronics Packaging Technology Conference | 0 | 0 |