公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
1991 | Thermal stresses due to thermal expansion anisotropy in materials with preferred orientation | Hsueh C.H.; Becher P.F.; CHUN-HWAY HSUEH | Journal of Materials Science Letters | |||
2014 | Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation | Diyatmika W.; Chu J.P.; Yen Y.W.; Chang W.Z.; Hsueh C.H.; CHUN-HWAY HSUEH | Thin Solid Films | |||
2006 | Thin-film adhesion measurement using laser-generated high-power surface acoustic wave | Kireev V.; Liu Y.; Braiman Y.; Radhakrishnan B.; Hsueh C.H.; Becher P.F.; CHUN-HWAY HSUEH | Applied Physics Letters | |||
1999 | Toughening Behavior in Ceramics and Cermets | Becher P.F.; Sun E.Y.; Hsueh C.H.; Plucknett K.P.; Kim H.D.; Hirao K.; Brito M.E.; CHUN-HWAY HSUEH | Key Engineering Materials |