公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2018 | Three dimensional modelling of grain boundary interaction and evolution during directional solidification of multi-crystalline silicon | Jain, T.; Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Journal of Crystal Growth | |||
2018 | Twinning mechanism at three-grain tri-junction during directional solidification of multi-crystalline silicon | Jain, T.; Lin, H.K.; Lan, C.W.; CHUNG-WEN LAN | Acta Materialia |