公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2018 | Failure assessments of polymeric structure for electronic connectors | Huang D.-C.; Juo, Yueh-Ting; KUO-CHI LIAO | 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems | 1 | 0 |