公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1990 | DC Electrical Analysis for Three-Dimensional Packaging Structures | 吳瑞北 ; Kuo, C. N.; Chiu, C. W.; Hsu, J. T.; Wu, Ruey-Beei | | | | |
1992 | Equivalent circuit of a through via in multi-layer environment | Chang, K. K.; Kuo, C. N.; Wu, T. L.; Chen, W. L.; Wu, Ruey-Beei | 1992 Electrical Performance of Electronic Packaging | 2 | 0 | |
2018 | Evidence for a second-order phase transition around 350 K in Ce3Rh4Sn13 | Kuo, C. N.; Chen, W. T.; Tseng, C. W.; Hsu, C. J.; Huang, R. Y.; Chou, F. C. ; Kuo, Y. K.; Lue, C. S. | Physical Review B | 14 | 13 | |
1992 | Inductance and Resistance Computations for Three-Dimensional Multiconductor Interconnection Structures | Wu, Ruey-Beei ; Kuo, C. N.; Chang, K. K. | IEEE Transactions on Microwave Theory and Techniques | 59 | 0 | |
2009 | V 51 NMR study of the spin-gap compound BiCu2 VO6: A microscopic probe of magnetic interactions | Lue, C. S.; Chen, S. C.; Kuo, C. N.; Chou, F. C. | Physical Review B - Condensed Matter and Materials Physics | 6 | 5 | |