公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2005 | Effects of interparticle dipole interaction on permalloy thin film arrays | Lai, J. Y.; Lai, M. F.; CHING-RAY CHANG ; Wei, Z. H.; Wu, J. C.; Lo, I. C.; Kuo, J. H.; Chang, Y. C.; Hsu, J. H.; Huang, J. R. | Journal of Applied Physics | 3 | 3 | |
1999 | Low-Voltage CMOS VLSI Circuits | Lou, J. B.; Kuo, J. H. | | | | |
2003 | Mold Filling Analysis in Evaporative Pattern Casting Process for Aluminum Alloy and Its Experimental Validation | Kuo, J. H.; Chen, J. C.; Hwang, W. S.; Pan, E. N. | AFS Trans | | | |
2003 | Mold Filling Analysis in Lost Foam Casting process for Aluminum Alloys and Its Experimental Validation | Kuo, J. H.; Chen, J. C.; Pan, Y. N.; Hwang, W. S. | Materials Transactions | | | |
2004 | Size effects on switching field of ring-shaped permalloy elements | Chang, C. C.; Chang, Y. C.; Wu, J. C.; Wei, Z. H.; Lai, M. F.; CHING-RAY CHANG ; Kuo, J. H. | Journal of Magnetism and Magnetic Materials | 4 | 4 | |