公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2008 | Precision wafer thinning and its surface conditioning technique | Young, H.-T.; Lin, C.-C.; Liao, H.-T.; Yang, M.; Young, H T.; Lin, C C.; Liao, H T.; Yang, M.; HONG-TSU YOUNG | International Journal of Materials and Product Technology | | | |
2019 | Seasonal variation of chemical characteristics of fine particulate matter at a high-elevation subtropical forest in East Asia | Lee, Celine S. L.; Chou, C. C.-K.; Cheung, H. C.; Tsai, C.-Y.; Huang, W.-R.; SHENG-HSIU HUANG ; Chen, M.-J.; Liao, H.-T.; CHANG-FU WU ; Tsao, T.-M.; MING-JER TSAI ; TA-CHEN SU | Environmental Pollution | 20 | 15 | |
2006 | Surface integrity of silicon wafers in ultra precision machining | Young, H.T.; Liao, H.-T.; Huang, H.-Y.; HONG-TSU YOUNG | International Journal of Advanced Manufacturing Technology | | | |