公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2023 | Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic System | Shih, Po Shao; Huang, Jeng Hau; Shen, Chang Hsien; Lin, Yu Chun; Grufner, Simon Johannes; Renganathan, Vengudusamy; Kao, Chin Li; LIN, Y. S.; Hung, Yun Ching; Chiang, Chun Wei; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 0 | 0 | |
2023 | A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging | Huang, Jeng Hau; Shih, Po Shao; Shen, Chang Hsien; Renganathan, Vengudusamy; Grafner, Simon Johannes; Lin, Yu Chun; Kao, Chin Li; LIN, Y. S.; Hung, Yun Ching; Chiang, Chun Wei; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 0 | 0 | |
2022 | Periodic copper microbead array on silver layer for dual mode detection of glyphosate | Balaji, Ramachandran; Renganathan, Vengudusamy; Chu, Chia Pei; YING-CHIH LIAO ; C. ROBERT KAO ; Chen, Shen Ming | OpenNano | 2 | 0 | |