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S.-T. Chen
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全文
2005
A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards
T.-K. Wang; C.-C. Wang; S.-T. Chen; Y.-H. Lin; TZONG-LIN WU
IEEE Int. Symp. Electromagn. Compat.
2004
A novel approach for the incorporation of arbitrary linear lumped network into FDTD method
TZONG-LIN WU
; Y.-S. Huang; S.-T. Chen
IEEE Microwave and Wireless Components Letters
23
2005
A novel embedded power plane with 10GHz stopband for simultaneous switching noise
C.-C. Wang; S.-M. Wu; C.-H. Chou; C.-W. Tsai; T.-K. Wang; Y.-H. Lin; S.-T. Chen; TZONG-LIN WU
Electron. Compon. Technol. Conf.
2004
A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures
TZONG-LIN WU
; Y.-H. Lin; S.-T. Chen
IEEE Microwave and Wireless Components Letters
73
2006
A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuit
TZONG-LIN WU
; S.-T. Chen
IEEE Transactions on Microwave Theory and Techniques
34
2006
An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits
TZONG-LIN WU
; S.-T. Chen
IEEE Microwave and Wireless Components Letters
2006
Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation
S. Sun; D. Pommerenke; J. Drewniak; K. Xiao; S.-T. Chen; TZONG-LIN WU
IEEE Int. Symp. Electromagn. Compat.
2004
Chip-level model of switching noise coupling on integrated system combining package and printed circuit board
S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; TZONG-LIN WU
IEEE Int. Symp. Electromagn. Compat. Eur. Workshop
2003
Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB)
S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; TZONG-LIN WU
Taiwan Electromagn. Compat. Conf.
2005
Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits
TZONG-LIN WU
; Y.-H. Lin; T.-K. Wang; C.-C. Wang; S.-T. Chen
IEEE Transactions on Microwave Theory and Techniques
187
2005
High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure
H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; TZONG-LIN WU
Asia-Pacific Symp. Electromagn. Compat.
2006
Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure
H.-C. Kuo; S.-T. Chen; TZONG-LIN WU
IEEE Elect. Performance Electron. Package. Systems
2007
Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method
T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; TZONG-LIN WU
IEEE Transactions on Advanced Packaging
2004
Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB
TZONG-LIN WU
; S.-T. Chen; J.-N. Huang; Y.-H. Lin
IEEE Transactions on Electromagnetic Compatibility
2005
Photonic crystal pwer substrate for wideband suppression of power/ground bounce noise and radiated emission in high-speed packages
S.-T. Chen; T.-S. Horng; TZONG-LIN WU
Asia-Pacific Symp. Electromagn. Compat.