公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2019 | A single bonding process for diverse organic-inorganic integration in IoT devices | Yang T.H.; Chiu Y.-S.; Yu H.-Y.; Shigetou A.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2019 | A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process | Yang T.H.; Yang C.Y.; Shigetou A.; C. ROBERT KAO | 2019 International Conference on Electronics Packaging |