公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2019 | Metagenomic, phylogenetic, and functional characterization of predominant endolithic green sulfur bacteria in the coral Isopora palifera | SHAN-HUA YANG ; Tandon, K.; Lu, C.-Y.; Wada, N.; Shih, C.-J.; Hsiao, S.S.-Y.; Jane, W.-N.; Lee, T.-C.; Yang, C.-M.; CHI-TE LIU ; VIANNEY DENIS ; Wu, Y.-T.; Wang, L.-T.; Huang, L.; Lee, D.-C.; Wu, Y.-W.; Yamashiro, H. | Microbiome | 37 | 21 | |
2012 | Micro/nano-sized diamond particles on Ni-columns for grinding application prepared by micro fabrication | Shih, C.-J.; Yeh, C.-H.; Lin, W.-C.; Lin, C.-S.; Chang, W.-C.; Pan, Y.-N.; CHAO-SUNG LIN | Proceedings of the IEEE Conference on Nanotechnology | | | |
2019 | A study of novel macrocyclic copper complex/graphene-based composite materials for counter electrodes of dye-sensitized solar cells | Yu, Y.-H.; Wang, W.-S.; Hu, Y.-C.; Tsai, C.-H.; Shih, C.-J.; Huang, W.-C.; Peng, S.-M. ; Lee, G.-H. | Journal of the Chinese Chemical Society | 7 | 5 | |
2012 | Surface-modified diamond embedded in nickel matrix composite for intrinsic polishing application | Shih, C.-J.; Lin, W.-C.; Lin, C.-S.; Pan, Y.-N.; CHAO-SUNG LIN | 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 | | | |
2013 | Test generation of path delay faults induced by defects in power TSV | Shih, C.-J.; Hsieh, S.-A.; Lu, Y.-C.; Li, J.C.-M.; Wu, T.-L.; TZONG-LIN WU ; YI-CHANG LU ; CHIEN-MO LI | Proceedings of the Asian Test Symposium | 2 | 0 | |
2016 | Unveiling conducting pathways embedded in strongly disordered graphene | Yang, W.-Y.; Wu, B.-Y.; Shih, C.-J.; Lo, S.-T.; Lee, H.-Y.; Chen, T.-M.; Chang, Y.H.; Chen, Y.F.; CHI-TE LIANG ; YANG-FANG CHEN | Semiconductor Science and Technology | 2 | 2 | |
2018 | Versatile Exciplex-Forming Co-Host for Improving Efficiency and Lifetime of Fluorescent and Phosphorescent Organic Light-Emitting Diodes | Shih, C.-J.; Lee, C.-C.; Yeh, T.-H.; Biring, S.; Kesavan, K.K.; Amin, N.R.A.; Chen, M.-H.; Tang, W.-C.; Liu, S.-W.; Wong, K.-T. | ACS Applied Materials and Interfaces | 55 | 50 | |