公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2011 | Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding | Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2009 | Interfacial reaction and wetting behavior between Pt and molten solder | Yang S.C.; Chang W.C.; Wang Y.W.; C. ROBERT KAO | Journal of Electronic Materials | 14 | 17 | |
2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
2018 | Materials merging mechanism of microfluidic electroless interconnection process | Yang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; C. ROBERT KAO | Journal of the Electrochemical Society | |||
2019 | Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compression | Wu J.Y.; Chiu Y.S.; Wang Y.W.; C. ROBERT KAO | Materials Science and Engineering A | |||
2009 | Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth | Wang Y.W.; Chang C.C. ; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2008 | Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth | Wang Y.W.; C. ROBERT KAO | 2008 10th International Conference on Electronic Materials and Packaging | |||
2019 | Phase formation and microstructure evolution in Cu/In/Cu joints | Chiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
2015 | Phase i study of nanoliposomal irinotecan (PEP02) in advanced solid tumor patients | Chang T.C.; Shiah H.S.; CHIH-HSIN YANG ; KUN-HUEI YEH ; ANN-LII CHENG ; Shen B.N.; Wang Y.W.; Yeh C.G.; Chiang N.J.; Chang J.Y.; Chen L.T. | Cancer Chemotherapy and Pharmacology | 87 | 74 | |
2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; C. ROBERT KAO | Journal of Electronic Materials |