公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2008 | Chip-package-board co-design - A DDR3 system design example from circuit designers' perspective | Lin, Y.-H.; Chou, J.; Lu, Y.-C.; Wu, T.-L.; YI-CHANG LU ; HSIN-SHU CHEN ; TZONG-LIN WU | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 | 9 | 0 | |
2019 | Compact quasi-elliptic bandpass filter using magnetically coupled LC resonator pair | Lin, T.-Y.; Wu, T.-L.; TZONG-LIN WU | Asia-Pacific Microwave Conference Proceedings, APMC | 0 | 0 | |
2017 | The competitions of electromagnetic for undergraduate students in Taiwan: Taiwan creative electromagnetic implementation competition T-CEIC | Tsai, Z.-M.; Wu, R.-B.; Wu, T.-L.; Chen, S.-Y.; Mao, S.-G.; SHAU-GANG MAO ; SHIH-YUAN CHEN | 2017 IEEE International Conference on Computational Electromagnetics, ICCEM 2017 | 0 | 0 | |
2019 | Design and analysis of an ultraminiaturized frequency selective surface with two arbitrary stopbands | Wei, P.-S.; Chiu, C.-N.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 31 | 27 | |
2019 | Design of a Broadband Common-Mode Filter with Four Transmission Zeros | Chan, C.-K.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 10 | 10 | |
2019 | Direct Simulation of the Full-Wave Partial Element Equivalent Circuit Using Standard SPICE [Application Notes] | Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | IEEE Microwave Magazine | 6 | 6 | |
2018 | Dual-band WLAN MIMO antenna with a decoupling element for full-metallic bottom cover tablet computer applications | Chou, J.-H.; Chang, J.-F.; Lin, D.-B.; Wu, T.-L.; TZONG-LIN WU | Microwave and Optical Technology Letters | 15 | 10 | |
2017 | Effective energy-saving device of Eco-Ship by using wave propulsion | Huang, S.-W.; Wu, T.-L.; Hsu, Y.-T.; Guo, J.-H.; Tsai, J.-F.; FORNG-CHEN CHIU ; JEN-HWA GUO ; JING-FA TSAI | Techno-Ocean 2016: Return to the Oceans | 7 | 0 | |
2019 | Enhanced power and signal integrity through layout optimization of high-speed memory systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.-H.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 1 | 0 | |
1992 | Equivalent circuit of a through via in multi-layer environment | Chang, K.K.; Kuo, C.-N.; Wu, T.-L.; Chen, W.-L.; Wu, R.-B.; TZONG-LIN WU | Electrical Performance of Electronic Packaging, EPEP 1992 | 4 | 0 | |
2018 | Factors affecting near-end crosstalk (NEXT) in high speed serial links | Weng, P.-Y.; Chen, C.-H.; Chen, C.-H.; Liao, C.-L.; Wu, T.-L.; Mutnury, B.; TZONG-LIN WU | 15th International Conference on Electromagnetic Interference and Compatibility, INCEMIC 2018 | 1 | 0 | |
2009 | High voltage lateral 4H-SiC JFETs on a semi-insulating substrate | Huang, C.-F.; Kan, C.-L.; Wu, T.-L.; Lee, M.-C.; Liu, Y.-Z.; Lee, K.-Y.; Zhao, F.; KUNG-YEN LEE | Device Research Conference | | | |
2019 | A High-Performance Common-Mode Noise Absorption Circuit Based on Phase Modification Technique | Chan, C.-K.; Wu, T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 11 | 13 | |
2009 | Impact of Photonic Crystal Power/Ground Layer density on power integrity performance of high-speed power buses | Scogna, A.C.; Orlandi, A.; Ricchiuti, V.; Wu, T.-L.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | 5 | 0 | |
2019 | Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 | 1 | 0 | |
2015 | Investigation of signal integrity issues in multi-path electrostatic discharge protection device | Huang, Y.-C.; Wu, T.-L.; Chen, C.-H.; TZONG-LIN WU | 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015 | 7 | 0 | |
2008 | A low cost dual-CPW differential line for two-layer PCBs | Chi, C.-J.; Chih-Wei, T.; Hsieh, J.-S.; Ko, W.-C.; Wu, T.-L.; TZONG-LIN WU | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | 0 | 0 | |
2019 | Miniaturized Quarter-Wavelength Resonator for Common-Mode Filter Based on Pattern Ground Structure | Liu, H.-W.; Cheng, C.-H.; Wu, T.-L.; TZONG-LIN WU | 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019 | 1 | 0 | |
2019 | A mm-Wave low-loss transition from microstrip line to air-filled substrate integrated wavguide on printed circuit board technology | Ting, C.-W.; Chen, K.-C.; Chen, S.; Wu, T.-L.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 5 | 0 | |
2019 | Modeling of radiated emission caused by coaxial-to-microstrip transition | Li, P.-J.; Chou, C.-C.; Wu, T.-L.; TZONG-LIN WU | Proceedings of the 2019 21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019 | 1 | 0 | |