公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2010 | Optimization of FIR filter to improve eye diagram for general transmission line systems | Y.-S. Cheng; Y.-C. Lai; RUEY-BEEI WU | Design, Automation, and Test in Europe Conference | |||
2011 | Passive FIR filter design using reflections from stubs for high speed links | Y.-S. Cheng; RUEY-BEEI WU | 2011 Electrical Design of Advanced Packaging and Systems | |||
2008 | Placement of shorting vias for power integrity in multi-layered structures | S.-H. Hsu; Y.-S. Cheng; W.-D. Guo; H.-H. Cheng; C.-C. Wang; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | |||
2011 | SI-aware layout and equalizer design to enhance performance of high-speed links in blade servers | Y.-S. Cheng; H.-H. Lu; M. Chang; S. Chang; B. Liu; RUEY-BEEI WU | IEEE 20th Topical Meeting on Electrical Performance of Electronic Packaging | |||
2013 | SI-aware vias and contact pads layouts and L-R equalization technique for 12Gb/s backplane serial I/O interconnections | Y.-S. Cheng; B. Liu; RUEY-BEEI WU | IEEE Transactions on Electromagnetic Compatibility | 3 |