Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2005 | Controlling the microstructures from the gold-tin reaction | Tsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; C. ROBERT KAO | Journal of Electronic Materials | |||
2006 | Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples | Chang C.W.; Lee Q.P.; Ho C.E.; C. ROBERT KAO | Journal of Electronic Materials | 24 | 23 | |
2004 | Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints | Tsai C.M.; Luo W.C.; Chang C.W.; Shieh Y.C.; C. ROBERT KAO | Journal of Electronic Materials | 63 | 57 | |
1992 | Distribution System Service Restoration Using a Heuristic Search Approach | YUAN-YIH HSU ; Huang, H. M.; Kou, H. C.; Peng S.K.; Chang C.W.; Chang K.J.; Yu H.S.; Chow C.E.; Kuo R.T. | IEEE Transactions on Power Delivery | 114 | ||
2004 | Efficient production of hydrogen from wastewater sludge | Wang C.C.; Chang C.W.; Chu C.P.; Lee D.J. ; Chang B.-V.; Liao C.S. | Journal of Chemical Technology and Biotechnology | 16 | 16 | |
2006 | Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints | Lin Y.L.; Chang C.W.; Tsai C.M.; Lee C.W.; C. ROBERT KAO | Journal of Electronic Materials | 45 | 43 | |
2017 | Evaluation of nasal patency by visual analogue scale/nasal obstruction symptom evaluation questionnaires and anterior active rhinomanometry after septoplasty: a retrospective one-year follow-up cohort study | Hsu H.C.; CHING-TING TAN ; Chang C.W.; Chu C.W.; Chiu Y.C.; Pan C.J.; Huang H.M. | Clinical Otolaryngology | 38 | 36 | |
2003 | Hydrogen production from wastewater sludge using a clostridium strain | Wang C.C.; Chang C.W.; Chu C.P.; Lee D.J. ; Chang B.V.; Liao C.S. | Journal of Environmental Science and Health - Part A Toxic/Hazardous Substances and Environmental Engineering | 17 | 15 | |
2006 | In-situ observation of material migration in flip-chip solder joints under current stressing | Tsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
2006 | Kinetics of AuSn 4 migration in lead-free solders | Chang C.W.; Ho C.E.; Yang S.C.; C. ROBERT KAO | Journal of Electronic Materials | 23 | 20 | |
2007 | Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Applied Physics | |||
2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Materials Research |