Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2007 | Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Applied Physics | |||
2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Materials Research |