公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2022 | A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging | Shih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
2022 | Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface | Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
1994 | Two-Dimensional Analgesic Ladders:a Comprehensive Strategy Towards Neuropathic Pain | Chen, Y. A.; Sun, Wei-Zen; Hou, W. Y.; Fu, S. H.; Lin, Shian-Yeang; 陳育安; 孫維仁; 侯文詠; Wen, Y. R.; 林仙養 | Chinese Journal of Pain | | | |