| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2017 | Continuous treatment with lenalidomide and low-dose dexamethasone in transplant-ineligible patients with newly diagnosed multiple myeloma in Asia: subanalysis of the FIRST trial | Lu J.; Lee J.H.; SHANG-YI HUANG ; Qiu L.; Lee J.-J.; Liu T.; Yoon S.-S.; Kim K.; Shen Z.X.; Eom H.S.; Chen W.M.; Min C.K.; Kim H.J.; Lee J.O.; Kwak J.Y.; Yiu W.; Chen G.; Ervin-Haynes A.; Hulin C.; Facon T. | British Journal of Haematology | 4 | ||
| 2011 | Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging | Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 13 | 0 | |
| 2010 | Effects of Ni additions on the growth of Cu 3Sn in high-lead solders | Wang Y.W.; Chang C.C.; Chen W.M.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 6 | 6 | |
| 2012 | Effects of Ti addition to Sn-Ag and Sn-Cu solders | Chen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 66 | 62 | |
| 2011 | The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction | Chen W.M.; Yang T.L.; Chung C.K.; Kao C.R.; C. ROBERT KAO | Scripta Materialia | 25 | 24 | |
| 2012 | Origin and evolution of voids in electroless Ni during soldering reaction | Chung C.K.; Chen Y.J.; Chen W.M.; Kao C.R.; C. ROBERT KAO | Acta Materialia | 25 | 26 | |
| 2010 | Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactions | Tsai M.H.; Chen W.M.; Tsai M.Y.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | 13 | 12 | |
| 2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO | Electronic Components and Technology Conference | 4 | 0 | |
| 2010 | Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrate | Chen W.M.; Kao C.R.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | 0 | 0 | |
| 2012 | Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium | Chen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO | Electronic Components and Technology Conference | 2 | 0 | |
| 2010 | Uncovering the driving force for massive spalling in the Sn-Cu/Ni system | Chen W.M.; Yang S.C.; Tsai M.H.; Kao C.R.; C. ROBERT KAO | Scripta Materialia | 23 | 20 |
