公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2013 | Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process | Chung C.K.; Chen Y.J.; Yang T.L.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 7 | |
2011 | Serum amyloid A induces lipolysis by downregulating perilipin through ERK1/2 and PKA signaling pathways. | Liu, LR; Lin S.P.; Chen C.C.; Chen Y.J.; Tai C.C.; Chang S.C.; Juang R.H.; Tseng Y.W.; Liu B.H.; Mersmann H.J.; Shen T.L.; RONG-HUAY JUANG ; SHIH-TORNG DING ; SHIH-CHUNG CHANG ; TANG-LONG SHEN ; SHAU-PING LIN | 30 | 28 | ||
2013 | Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics | Chen Y.J.; Chung C.K.; Yang C.R.; C. ROBERT KAO | Microelectronics Reliability | |||
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 | |
2014 | Transportation and economies of scale in recycling low-value materials | Sheu J.-B.; Chen Y.J.; JIUH-BIING SHEU | Transportation Research Part B: Methodological | 15 | 14 |