公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2000 | Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate | Chen C.; Ho C.E.; Lin A.H.; Luo G.L.; C. ROBERT KAO | Journal of Electronic Materials | |||
2007 | Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Applied Physics | |||
2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
2000 | Optimizing the wire-bonding parameters for second bonds in ball grid array packages | Ho C.E.; Chen C.; C. ROBERT KAO | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an | |||
1999 | Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system | Jain T.A.; Huang C.G.; Ho C.E.; C. ROBERT KAO | Materials Transactions | |||
1999 | Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering | Ho C.E.; Chen Y.M.; C. ROBERT KAO | Journal of Electronic Materials | |||
2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho C.E.; Tsai S.Y.; C. ROBERT KAO | IEEE Transactions on Advanced Packaging | |||
2002 | Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Shiau L.C.; Ho C.E.; C. ROBERT KAO | Soldering and Surface Mount Technology | 110 | 101 | |
2001 | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Liu C.M.; Ho C.E.; Chen W.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2001 | Selective interfacial reaction between Ni and eutectic BiSn lead-free solder | Tao W.H.; Chen C.; Ho C.E.; Chen W.T.; C. ROBERT KAO | Chemistry of Materials | |||
2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; C. ROBERT KAO | Materials Science and Engineering A | |||
2002 | Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni | Ho C.E.; Lin Y.L.; C. ROBERT KAO | Chemistry of Materials | 77 | 73 | |
2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang S.C.; Ho C.E.; Chang C.W.; C. ROBERT KAO | Journal of Materials Research | |||
2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |