公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2000 | Importance of amorphous intergranular films in self-reinforced Si3N4 ceramics | Becher P.F.; Painter G.S.; Sun E.Y.; Hsueh C.H.; Lance M.J.; CHUN-HWAY HSUEH | Acta Materialia | |||
1999 | Influence of residual stress on thermal expansion behavior | Wang X.-L.; Hoffmann C.M.; Hsueh C.H.; Sarma G.; Hubbard C.R.; Keiser J.R.; CHUN-HWAY HSUEH | Applied Physics Letters | |||
2006 | Interfacial peeling moments and shear forces at free edges of multilayers subjected to thermal stresses | Hsueh C.H.; Luttrell C.R.; Lee S.; Wu T.C.; Lin H.Y.; CHUN-HWAY HSUEH | Journal of the American Ceramic Society | |||
2017 | Microstructure and mechanical properties of Zr-Ti-Cu-Nd metallic glass composites | Wu Y.H.; Wang C.; Hsueh C.H.; Li T.H.; Chang C.H.; Chen H.C.; Jang J.S.C.; Huang J.C.; Ma Z.H.; CHUN-HWAY HSUEH | Journal of Alloys and Compounds | |||
2003 | Modeling of elastic thermal stresses in two materials joined by a graded layer | Hsueh C.H.; Lee S.; CHUN-HWAY HSUEH | Composites Part B: Engineering | |||
2006 | Modeling of thermal stresses in joining two layers with multi- and graded interlayers | Hsueh C.H.; De Jonghe L.C.; CHUN-HWAY HSUEH | Journal of the American Ceramic Society | 22 | 22 | |
2006 | Modelling of bonded multilayered disks subjected to biaxial flexure tests | CHUN-HWAY HSUEH ; Hsueh C.H.; Luttrell C.R.; Becher P.F. | International Journal of Solids and Structures | 32 | 27 | |
2004 | Multiple cracking of brittle coatings on strained substrates | Hsueh C.H.; Wereszczak A.A.; CHUN-HWAY HSUEH | Journal of Applied Physics | |||
2003 | Multiple film cracking in film/substrate systems with residual stresses and unidirectional loading | Hsueh C.H.; Yanaka M.; CHUN-HWAY HSUEH | Journal of Materials Science | |||
2018 | Nanoscaled superelastic behavior of shape memory alloy/metallic glass multilayered films | Jhou W.T.; Wang C.; Ii S.; Hsueh C.H.; CHUN-HWAY HSUEH | Composites Part B: Engineering | |||
2015 | Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications | Yu J.J.; Yang C.A.; Lin Y.F.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | 32 | 32 | |
2008 | Origins of tensile stress-induced circumferential cracking of waterwall tubes in boilers | Hsueh C.H.; Wright I.G.; CHUN-HWAY HSUEH | Materials at High Temperatures | |||
1983 | Oxidation induced stresses and some effects on the behavior of oxide films | Hsueh C.H.; Evans A.G.; CHUN-HWAY HSUEH | Journal of Applied Physics | |||
1996 | R-curve response of silicon carbide whisker-reinforced alumina: microstructural influence | Sun E.Y.; Hsueh C.H.; Becher P.F.; CHUN-HWAY HSUEH | Materials Research Society Symposium | |||
2013 | Rapid relaxation and embrittlement of Zr-based bulk metallic glasses by electropulsing | Yiu P.; Chen Y.C.; Chu J.P.; Chang S.Y.; Bei H.; Jang J.S.C.; Hsueh C.H.; CHUN-HWAY HSUEH | Intermetallics | |||
2014 | Rapid thermoplastic formation of Fe-based metallic glass foil achieved by electropulsing | Yiu P.; Hsueh C.H.; Shek C.H.; CHUN-HWAY HSUEH | Materials Letters | |||
2007 | Recent advances in modeling stress distributions in multilayers subjected to biaxial flexure tests | Hsueh C.H.; Luttrell C.R.; CHUN-HWAY HSUEH | Composites Science and Technology | |||
1993 | The relative residual fibre displacement after indentation loading and unloading of fibre-reinforced ceramic composites | Hsueh C.H.; Ferber M.K.; Wereszczak A.A.; CHUN-HWAY HSUEH | Journal of Materials Science | |||
1988 | Residual stress and strain in pyrolytic boron nitride resulting from thermal anisotropy | Naito N.; Hsueh C.H.; CHUN-HWAY HSUEH | Journal of Materials Science | |||
1985 | Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging | HSUEH C.H.; EVANS A.G.; CHUN-HWAY HSUEH | Journal of the American Ceramic Society |