公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2022 | Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating | Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; C. ROBERT KAO ; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
1993 | Effect of quenching temperature on the formation and magnetic properties of the ferromagnetic τ-phase in Mn---Al---C alloys | Huang, J. H.; Kuo, P. C. | Materials Science and Engineering B | | | |
1993 | Effect of Quenching Temperature on the Phase Transformation and Magnetic Properties of MnAl Alloy | 郭博成; Huang, J. H.; Kuo, Po-Cheng | The 8th Annual Symposium on Magnetism and Magnetic Materials | | | |
1988 | Effect of Silica Coating on the Magnetic Properties of γ-Fe2O3 Particles | 郭博成; Huang, J. H.; Kuo, Po-Cheng | The 4th Annual Symposium on Magnetism and Magnetic Materials | | | |
1991 | Electrical Resistivity and Magnetic Properties of Mn-Al Magnets | 郭博成; Yao, Y. D.; Huang, J. H.; Chen, C. H.; Kuo, Po-Cheng | The 6th Annual Symposium on Magnetism and Magnetic Materials | | | |
2023 | Enhanced Reactivity of Electroless Cu Interconnection by Surface Oxidation Pretreatment | Lin, Y. C.; Shen, C. H.; Hung, C. Y.; Shih, P. S.; Huang, J. H.; Kao, C. L.; Lin, Y. S.; Hung, Y. C.; C. ROBERT KAO | 2023 International Conference on Electronics Packaging, ICEP 2023 | 0 | 0 | |
1991 | Fabrication and Magnetic Property of Mn-Al Permanent Magnets | 郭博成; Yao, Y. D.; Huang, J. H.; Chen, C. H.; Kuo, Po-Cheng | International Conference on Magnetism, Edinburgh | | | |
1993 | h媒體辦公室系統產學合作計 劃 | Wu, C. L.; Chen, W. C.; Huang, J. H.; Ouhyoung, Ming | National Science Council Monthly | | | |
1994 | Influence of carbon on the phase transformation kinetics and magnetic properties of Mn---Al alloys | Huang, J. H.; Kuo, P. C. | Materials Science and Engineering B | | | |
2022 | Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulation | Grafner, S. J.; Huang, J. H.; Chen, Y. A.; Shih, P. S.; Huang, C. H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 3 | 0 | |
1994 | Magnetic properties and microstructure of Lanthanum-doped Mn-Al and Mn-Al-C permanent Magnets | Huang, J. H.; Kuo, P. C.; Chen, C. H. | Journal of Materials Science | | | |
1999 | Magnetic properties and microstructure of Mn–Al–C thin films | Kuo, P. C.; Ker, K. J.; Yao, Y. D.; Huang, J. H. | Journal of Applied Physics | | | |
2006 | Measuring college student drinking: Illustrating the feasibility of a composite drinking scale | Huang, J. H.; DeJong, W.; Schneider, S. K.; Towvim, L. G. | Substance Abuse | | | |
1997 | Microstructural and magnetic studies of Mn–Al thin films | Kuo, P. C.; Yao, Y. D.; Huang, J. H.; Shen, S. C.; Jou, J. H. | Journal of Applied Physics | | | |
2009 | Nonlinear dispersion relation for surface plasmon at a metal-Kerr medium interface | Huang, J. H.; Chang, R. L.; Leung, P. T.; Tsai, D. P. | Optics Communications | | | |
2022 | A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging | Shih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
1997 | Preparation and magnetical studies of Mn50Al50/Al bilayer films | Kuo, P. C.; Yao, Y. D.; Chen, W. R.; Huang, J. H. | Journal of Applied Physics | | | |
1998 | Research and Development of Software Modules for Multimedia Digital Classroom | Wu, J. L.; Chen, W. C.; Huang, J. H.; Ouh Young, M. | National Science Council Monthly | | | |
1992 | Sintered MnAl and MnAlC magnets | Huang, J. H.; Kuo, P. C. | Materials Science and Engineering B | | | |
2022 | Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface | Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |