公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2016 | Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | |||
2018 | Materials merging mechanism of microfluidic electroless interconnection process | Yang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; C. ROBERT KAO | Journal of the Electrochemical Society | |||
2019 | Phase formation and microstructure evolution in Cu/In/Cu joints | Chiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2019 | Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits | Weng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO | Scripta Materialia |