公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2019 | Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits | Weng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO | Scripta Materialia |