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Kao C.R.
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全文
2019
Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface
Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO
Scientific Reports
8
2018
Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation
Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference
2016
Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study
Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO
Acta Materialia
1993
Phase equilibria of the cu-in system I: Experimental investigation
Bolcavage A.; Chen S.W.; Kao C.R.; Chang Y.A.; Romig A.D.; C. ROBERT KAO
Journal of Phase Equilibria
1993
Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagram
Kao C.R.; Bolccwage A.; Chen S.-L.; Chen S.W.; Chang Y.A.; Romig A.D.; C. ROBERT KAO
Journal of Phase Equilibria
1997
Reactions of solid copper with pure liquid tin and liquid tin saturated with copper
Hayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO
Scripta Materialia
1996
Reactive diffusion between silicon and niobium carbide: Application to the in-situ synthesis of a silicon carbide-niobium disilicide composite
Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO
TMS Annual Meeting
2019
Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits
Weng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO
Scripta Materialia
2015
Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing
Li C.C.; Drymiotis F.; Liao L.L.; Dai M.J.; Liu C.K.; Chen C.L.; Chen Y.Y.; Kao C.R.; Snyder G.J.; C. ROBERT KAO
Energy Conversion and Management
1994
Site preference of substitutional additions to triple-defect B2 intermetallic compounds
Kao C.R.; Pike L.M.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO
Intermetallics
2012
Soldering reactions under space confinement for 3D IC applications
Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO
Electronic Components and Technology Conference
10
0
2005
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO
Materials Research Society Symposium
1995
Synthesis of in situ composites through solid-state reactions: thermodynamic, mass-balance and kinetic considerations
Kao C.R.; Woodford J.; Kim S.; Zhang M.-X.; Chang Y.A.; C. ROBERT KAO
Materials Science and Engineering A
1993
A theoretical analysis for the formation of periodic layered structure in ternary diffusion couples involving a displacement type of reactions
Kao C.R.; Chang Y.A.; C. ROBERT KAO
Acta Metallurgica Et Materialia