公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2017 | Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint | Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2015 | Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique | Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
1995 | Diffusional behavior in B2 intermetallic compounds | Kao C.R.; Kim S.; Chang Y.A.; C. ROBERT KAO | Materials Science and Engineering A | |||
2008 | Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish | Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
2006 | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 138 | 116 | |
2003 | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | Hu Y.C.; Lin Y.H.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Journal of Materials Research | |||
2017 | Fast Atom Beam- and Vacuum-Ultraviolet-Activated Sites for Low-Temperature Hybrid Integration | Yang H.-W.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Langmuir | |||
1995 | A generalized quasi-chemical model for ordered multi-component, multi-sublattice intermetallic compounds with anti-structure defects | Chen S.-L.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Intermetallics | |||
2018 | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | |||
2013 | Interfacial reactions and electromigration in flip-chip solder joints | Ho C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Advanced Flip Chip Packaging | |||
2015 | Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials | Li C.C.; Drymiotis F.; Liao L.L.; Hung H.T.; Ke J.H.; Liu C.K.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Journal of Materials Chemistry C | |||
2006 | Journal of Electronic Materials: Foreword | Suganuma K.; Chen S.-W.; Kao C.R.; Lee H.M.; Swenson D.J.; C. ROBERT KAO | Journal of Electronic Materials | 0 | 0 | |
2019 | Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications | Wu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
1996 | A mechanism for reactive diffusion between Si single crystal and NbC powder compact | Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO | Journal of Materials Research | |||
1990 | Model for micelle formation in copolymer/homopolymer blends | Kao C.R.; De La Cruz M.O.; C. ROBERT KAO | The Journal of Chemical Physics | |||
2016 | Novel Self-shrinking Mask for Sub-3 nm Pattern Fabrication | Yang P.-S.; Cheng P.-H.; Kao C.R.; C. ROBERT KAO ; MIIN-JANG CHEN | Scientific Reports | 9 | 12 | |
1993 | On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds | Kao C.R.; Chang Y.A.; C. ROBERT KAO | Intermetallics | |||
1993 | On the optimization of solution model parameter values of phases and the calculation of phase diagrams | Chen S.-L.; Zuo Y.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Calphad | |||
1996 | On the site preferences of ternary additions to triple defect B2 intermetallic compounds | Pike L.M.; Kao C.R.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO | TMS Annual Meeting |