公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2006 | Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials | 31 | 27 | |
2008 | Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Lin Y.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
2009 | Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates | CHIEN-CHENG CHANG ; Lin Y.W.; Lai Y.S.; C. ROBERT KAO | Journal of Electronic Materials | 6 | 5 | |
2011 | Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding | Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 |