公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
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2008 | Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskers | Chuang, T.H.; Lin, H.J.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | |||
2014 | Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer | Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG | Journal of Electronic Materials |