| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2002 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Ho C.E.; Tsai R.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 294 | 262 | |
| 2006 | Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Tsai C.M.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 29 | 26 | |
| 2008 | Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 21 | 15 | |
| 2004 | Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints | Lin Y.L.; Luo W.C.; Lin Y.H.; Ho C.E.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 15 | 14 | |
| 2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO | Materials Science Forum | 4 | ||
| 2005 | Electromigration-induced failure in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 86 | 79 | |
| 2006 | Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints | Lin Y.L.; Chang C.W.; Tsai C.M.; Lee C.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 41 | 41 | |
| 2011 | Experimental evidence for formation of Ni-Al compound in flip-chip joints under current stressing | Tsai M.Y.; Lin Y.L.; Tsai M.H.; Chen Y.J.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 1 | 1 | |
| 2006 | In-situ observation of material migration in flip-chip solder joints under current stressing | Tsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 9 | 9 | |
| 2006 | Local melting induced by electromigration in flip-chip solder joints | Tsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 51 | 49 | |
| 2002 | Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages | Lin Y.L.; Tsai J.; Kao C.R.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | 2 | 0 | |
| 2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 34 | 30 | |
| 1995 | Phenotypic and functional analysis of natural killer cells in systemic lupus erythematosus patients. | BOR-LUEN CHIANG ; Chen Y.C.; Wang C.R.; Lin Y.L.; Chou C.C.; Hsieh K.H. | Zhonghua Minguo xiao er ke yi xue hui za zhi [Journal]. Zhonghua Minguo xiao er ke yi xue hui | 5 | 0 | |
| 2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Materials Science and Engineering A | 109 | 98 | |
| 2002 | Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni | Ho C.E.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Chemistry of Materials | 74 | 71 | |
| 2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 23 | 25 | |
| 2010 | Transmission electron microscopy characterization of Ni(V) metallization stressed under high current density in flip chip solder joints | Tsai M.Y.; Lin Y.L.; Lin Y.W.; Ke J.H.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 2 | 2 |
