| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Materials Science and Engineering A | 109 | 98 | |
| 2002 | Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni | Ho C.E.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Chemistry of Materials | 74 | 71 | |
| 2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 23 | 25 | |
| 2010 | Transmission electron microscopy characterization of Ni(V) metallization stressed under high current density in flip chip solder joints | Tsai M.Y.; Lin Y.L.; Lin Y.W.; Ke J.H.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 2 | 2 |
