| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2009 | Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate | Tsai M.H.; Lin Y.W.; Chuang H.Y.; Kao C.R.; C. ROBERT KAO | Journal of Materials Research | |||
| 2008 | Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | |||
| 2006 | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; Jiang D.S.; C. ROBERT KAO | Journal of Electronic Materials | |||
| 2009 | Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu | Wang Y.W.; Lin Y.W.; Tu C.T.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
| 2010 | The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering | Chang C.C.; Lin Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
| 2010 | Electromigration in flip chip solder joints under extra high current density | Lin Y.W.; Ke J.H.; Chuang H.Y.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Journal of Applied Physics | |||
| 1998 | Fluorescence microsatellite analysis to study the parental origin of the supernumerary chromosome in Down's syndrome | Ko T.M.; HSIAO-LIN HWA ; Tseng L.H.; Lin Y.W.; Cheung Y.P. | International Journal of Gynecology and Obstetrics | |||
| 2009 | Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates | Chang C.C.; Lin Y.W.; Lai Y.S.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | |||
| 2010 | Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders | Wang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
| 2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Microelectronics Reliability | |||
| 2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang J.R.; Tsai C.M.; Lin Y.W.; Kao C.R.; C. ROBERT KAO | Journal of Materials Research | |||
| 2007 | Tin whisker growth induced by high electron current density | Lin Y.W.; Kao C.R.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
| 2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | |||
| 2010 | Transmission electron microscopy characterization of Ni(V) metallization stressed under high current density in flip chip solder joints | Tsai M.Y.; Lin Y.L.; Lin Y.W.; Ke J.H.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | |||
| 2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |
