公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2017 | Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint | Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2018 | Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process | Yang S.; Hung H.-T.; Nishikawa H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2018 | Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium | Yang C.A.; Yang S.; Liu X.; Nishikawa H.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
2018 | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
2018 | Materials merging mechanism of microfluidic electroless interconnection process | Yang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; C. ROBERT KAO | Journal of the Electrochemical Society |