公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | Controlling the microstructures from the gold-tin reaction | Tsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; C. ROBERT KAO | Journal of Electronic Materials | |||
2004 | Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints | Tsai C.M.; Luo W.C.; Chang C.W.; Shieh Y.C.; C. ROBERT KAO | Journal of Electronic Materials | 63 | 57 |