公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2013 | Thermal-Cyclic Fatigue Life Analysis and Reliability Estimation of a FCCSP based on Probabilistic Design Concept, | Hsu, Y.; Su, C.Y.; Wu, W.F. | Computers, Materials and Continua | 2 | | |
2011 | Thermal-Cyclic Fatigue Reliability Analysis of Electronic Packages based on Probabilistic Design Concept | Su, C.Y.; Wu, W.F. ; Hsu, Y. | The 6th Japan-Taiwan Workshop on Mechanical and Aerospace Engineering | | | |
2010 | Variability of impact life and reliability assessment of electronic packages | Hsu, Y.; Wu, W.F. ; Su, C.Y. | 12th Electronics Packaging Technology Conference, EPTC 2010 | 0 | 0 | |