公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2006 | Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration | Lin, Y.L.; Lai, Y.S.; Tsai, C.M.; Kao, C.R. | Journal of Electronic Materials | | | |
1980 | Effects of gamma radiation and chemical treatments on controlling the postharvest diseases of patatoes and onions | 吳文希; Wu, C.H.H.; Chu, S.L.; Fu, Y.K.; Tsai, C.M.; Wu, W.S. | Memoirs of the College of Agriculture | | | |
2006 | In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing | Tsai, C.M.; Lai, Yi-Shao; Lin, Y.L.; Chang, C.W.; Kao, C.R. | Journal of Electronic Materials | | | |